| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a method of manufacturing a semiconductor device capable of improving adhesion between mold resin and underfill resin exposed on a side of a ball surface of a semiconductor package to prevent them from peeling on an interface. <P>SOLUTION: The manufacturing method includes a sputtering step of causing the mold resin containing wax or fatty acid to sputter the ball surface of the semiconductor package exposed on the side of the ball surface by Ar plasma, a step of flip-chip-bonding the semiconductor package onto a wiring substrate after the sputtering step, and a step of filling the underfill resin between the semiconductor package and the wiring substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
