| 摘要 |
A thermal process system with an across-flow line is provided to process uniformly and rapidly the surface of a batch of substrates at a desired temperature while an annealing process, a deposition process or a layer removal process is performed on the batch of substrates, by including a thermal process apparatus for processing a substrate fixed to a carrier with a high temperature or an increased temperature. A cylinder has a sealing end and an open end. A batch of wafer carriers(106) having a plurality of wafer support positions are received in the cylinder through the open end. An across-flow liner includes a first column of orifices aligned axially, including a first injector for defining a first injector height and a first vertical axis. The cylinder includes a plurality of vertically disposed exhaust ports or slots. The first injector is coupled to a first fluid supply source. Each one of the first columns of the orifices aligned axially is aligned with one of the plurality of wafer support positions. A second injector includes a second column of orifices aligned axially, including a second injector for defining a second injector height and a second vertical axis. The second injector is coupled to a second fluid supply source so that each one of the second column of orifices is aligned with one of the plurality of wafer support positions.
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