| 摘要 |
A laser processing method by which especially a stacked part can be highly accurately cut at the time of cutting a processing object provided with a substrate and the stacked part which is formed on a front plane of the substrate by including a function element. Under the condition where a protection tape (22) is adhered on a front plane (16a) of the stacked part (16), a laser beam (L) is applied by having a rear plane (4b) of the substrate (4) as a laser beam incidence plane to form a modified region (7) inside the substrate (4) along a cut planned line, and a crack (24) reaching the front plane (4a) of the substrate (4) from a front plane side edge part (7a) of the modified region (7) is generated. Under such condition where the crack (24) is generated, when an expand tape is adhered on the rear plane (4b) of the substrate (4) and expanded, not only the substrate (4) but also the stacked part (16) on the cut planned line, namely, interlayer insulating films (17a, 17b), can be accurately cut along the cut planned line. |
