发明名称 |
Wafer and method for producing the same |
摘要 |
A wafer is produced at a step of polishing a predetermined face of a wafer to flatten the predetermined face while supplying a polishing liquid onto a bonded abrasive cloth, wherein the bonded abrasive cloth comprises a urethane bonding material consisting of a soft segment having a polyfunctional isocyanate and a hard segment having a polyfunctional polyol and having an expansion ratio of 1.1-4 times and silica having an average particle size of 0.2-10 µm and a hydroxy group, and has a given ratio of the hard segment occupied in the urethane bonding material, a given volume ratio of silica and a given Shore D hardness.
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申请公布号 |
EP1820603(A2) |
申请公布日期 |
2007.08.22 |
申请号 |
EP20070001408 |
申请日期 |
2007.01.23 |
申请人 |
SUMCO CORPORATION |
发明人 |
MORITA, ETSUROU;HUJIE, KAZUO;ONO, ISOROKU |
分类号 |
B24B37/04;B24D3/28;B24D11/00;H01L21/302;H01L21/304 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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