| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board for a semiconductor package and a manufacturing method thereof, in which a fine pitch can be obtained through an economical process, and which have the advantage to increase the height of a pre-solder to thus enhance bondability and underfilling capability, and in which a pre-solder having a desired height can be obtained by adjusting the plating thickness. <P>SOLUTION: A printed circuit board 100 for a package with predetermined circuit patterns has a wire bonding portion 102 and a bump portion 103 for mounting a semiconductor, and a soldering portion 104 for connection to external components, in which at least the bump portion 103 of the portions (the wire bonding portion 102, the bump portion 103, and the soldering portion 104) includes a copper or copper alloy layer and an electrolytic tin plating or tin alloy plating layer formed on the copper or copper alloy layer. <P>COPYRIGHT: (C)2007,JPO&INPIT |
