| 摘要 |
A high speed line for backward matching is provided to obtain the signal integrity by matching backward impedance and removing signal noises due to the signal reflection. A high speed line for backward matching includes a master device(300), a slave device(320), a transmission line(309), and a pair of through vias(301,307). The transmission line(309) connects the master device(300) and the slave device(320), and is formed in a PCB(Printed Circuit Board). The pair of through vias(301,307) are placed on the position of the transmission line(309) which is far from the master device(300) and the slave device(320) by the predetermined interval.
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