发明名称 |
Thermal interface material |
摘要 |
<p>A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of acrylic polymer, one or more liquid resins, conductive filler particles and optionally one or more solid resins.</p> |
申请公布号 |
EP1816175(A2) |
申请公布日期 |
2007.08.08 |
申请号 |
EP20070001862 |
申请日期 |
2007.01.29 |
申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
COLLINS, ANDREW;CHENG, CHIH-MIN |
分类号 |
C09J9/02;H01L21/58;H01L23/373 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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