发明名称 Thermal interface material
摘要 <p>A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of acrylic polymer, one or more liquid resins, conductive filler particles and optionally one or more solid resins.</p>
申请公布号 EP1816175(A2) 申请公布日期 2007.08.08
申请号 EP20070001862 申请日期 2007.01.29
申请人 NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION 发明人 COLLINS, ANDREW;CHENG, CHIH-MIN
分类号 C09J9/02;H01L21/58;H01L23/373 主分类号 C09J9/02
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