发明名称 Increase productivity at wafer test using probe retest data analysis
摘要 Disclosed is a method and system for testing integrated circuit devices after manufacture wherein, an initial group of devices is tested to produce an initial failing group of devices that failed the testing. The devices in the initial failing group are identified by type of failure. Then, the devices in the initial failing group are retested to identify a retested passing group of devices that passed the retesting. Next, the devices in the retested passing group are analyzed to produce statistics regarding the likelihood that a failing device that failed the initial testing will pass the retesting according to the type of failure. Then, these statistics are evaluated to determine which types of failures have retest passing rates above a predetermined threshold. From this, a database is produced that includes an optimized retest table listing the types of defects that are approved for retesting.
申请公布号 US7253650(B2) 申请公布日期 2007.08.07
申请号 US20040709729 申请日期 2004.05.25
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BALCHIUNAS AKIKO F.
分类号 G01R31/26;B07C5/344;G01R27/28;G01R31/00;G01R31/14;G01R31/28;G06F19/00 主分类号 G01R31/26
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