| 摘要 |
An apparatus for manufacturing a semiconductor device is provided to prevent the deviation of a wafer from a disc pad and to improve the yield by loading stably a wafer in a disc pad direction using an acute finger. An apparatus for manufacturing a semiconductor device includes a disc pad(120) for loading stably a wafer, a fence, and a finger. The fence(130) is installed at one side of a periphery of the disc pad to support the wafer. The finger(140) is installed at the other side of the periphery of the disc pad. The finger is capable of pressing the wafer toward the disc pad, so that the wafer is stably fixed to the disc pad. The finger is made of an elastic material.
|
