METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

A manufacturing method of a PCB(Printed Circuit Board) is provided to form an insulating substrate with several engraved patterns by collectively mounting and compressing a plurality of imprinting molds and insulating substrates. A manufacturing method of a PCB includes the steps of: laminating an insulating substrate with a first align hole corresponding to a guide pin on a supporting plate coupled with the guide pin to insert the guide pin into the first align hole(S100); laminating an imprinting mole with a second align hole corresponding to the guide pin on the supporting plate to insert the guide pin into the second align hole(S200); and laminating and pressing a pressing plate on the supporting plate, and pressing the insulating substrate and the imprinting mold(S300). An engraved pattern corresponding to a circuit pattern is formed on a surface facing the imprinting mold of the insulating substrate. An embossing pattern corresponding to the circuit pattern is formed on a surface facing the insulating substrate of the imprinting mold.