| 摘要 |
A WLCSP(Wafer Level Chip Scale Package) and its manufacturing method are provided to improve a BLR(Board Level Reliability) by enhancing a solder bonding capability using a bump pad of an NSMD(Non Solder Mask Defined) type. A WLCSP includes a semiconductor chip, a first insulating layer, a rerouting layer, a mold resin layer, and a solder bump. The semiconductor chip(112) includes an inactive layer for covering an upper surface of a silicon substrate except chip pads of the substrate. The first insulating layer(120) is used for covering the inactive layer except the chip pads. The rerouting layer(150) is connected with the chip pads on the first insulating layer. A bump pad(152) is formed on one end portion of the rerouting layer. A mold resin layer(170) is formed on the first insulating layer to cover the rerouting layer. The mold resin layer includes an opening portion for exposing completely the bump pad to the outside. The solder bump(180) is formed on the bump pad.
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