| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure in which a rigid heat conduction plate with a high heat transport performance can be attached, a stress of a solder joint of electronic parts can be mitigated, and further a part packaging density of a substrate is not reduced. SOLUTION: Both ends of the heat conduction plate in which a sheet-shaped heat conduction member with the elasticity is stuck to an upper part of an electronic part and a cabinet are fixed by use of a springy part. COPYRIGHT: (C)2007,JPO&INPIT
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