| 发明名称 |
METHOD OF PROCESSING SUBSTRATE AND CHEMICAL USED IN THE SAME |
| 摘要 |
A substrate processing method and chemicals used in the same are provided to prevent an organic pattern and a substrate from being damaged. A predetermined treatment is performed on an organic pattern of a substrate to remove a deformed layer from the organic pattern. The deformed layer removing process is performed by supplying predetermined chemicals onto the organic pattern. The predetermined chemicals contain at least an organic solvent. The organic solvent contains at least amine. The organic solvent contains the amine of 0.01 to 10 weight%. The amine in the organic solvent is capable of being in a range of 0.05 to 1.5 weight%.
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| 申请公布号 |
KR20070077163(A) |
申请公布日期 |
2007.07.25 |
| 申请号 |
KR20070062484 |
申请日期 |
2007.06.25 |
| 申请人 |
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发明人 |
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| 分类号 |
G03F7/40;H01L21/306;C23F1/00;H01L21/00;H01L21/02;H01L21/027;H01L21/3065;H01L21/311;H01L21/3213 |
主分类号 |
G03F7/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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