MULTI-LAYER PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREFORE

摘要

A multi-layered printed circuit board and a fabricating method thereof are provided to obtain a high dielectric characteristic in radio frequency environment and to reduce a transmission loss. A multi-layered printed circuit board includes a glass flat plate(11), an inner resin compound, an inner circuit(21), a conductive hole(19), an outer circuit, and a blind via hole. The glass flat plate(11) has a plurality of through holes. The inner resin compound is filled inside the through holes and is laminated on both sides of the glass flat plate(11). The inner circuit(21) is formed in a metal layer which is laminated on the inner resin compound. The conductive hole(19) connects the inner circuits which are formed on both sides of the inner resin compound respectively. An outer resin compound and the outer circuit are formed on the inner circuit in sequence. The blind via hole connects the outer circuits which are both sides of the outer resin compound respectively.