| 摘要 |
<p>A method for exposing a wafer edge using a batch type is provided to reduce process TAT(Turn Around Time) used in a device manufacture by using a batch type WEE(Wafer Edge Exposure) process instead of a single type WEE process. A plurality of wafers(101) on which photoresist layers are coated are loaded in a bath type cassette(100) to be arranged therein. The arranged wafers are tilted in a preset angle required for a wafer edge exposure. The cassette is made of a transparent material. The tilted wafers are rotated to exposure wafer edge exposure areas thereof by using a wafer edge exposure lamp. A wafer in an upper most slot out of the wafers is used as a dummy wafer to perform the wafer edge exposure process in a batch type.</p> |
