| 摘要 |
An adhesion promoter which comprises from 2 to 100% by weight of a copolymer which contains the following monomer units: a) from 70 to 99.9% by weight of monomer units which derive from vinyl compounds selected from acrylic acid derivatives, methacrylic acid derivatives, and vinylaromatics, and also b) from 0.1 to 30% by weight of monomer units which contain a functional group selected from a carboxylic anhydride group, an epoxy group, and an oxazoline group, is used for production of a bond between I. a layer composed of a polyamide molding compound, and II. a part composed of an ABS molding composition.
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