发明名称 IN-MOLD CHIP ATTACH
摘要 A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.
申请公布号 WO2007079277(A2) 申请公布日期 2007.07.12
申请号 WO2006US60442 申请日期 2006.11.01
申请人 CHECKPOINT SYSTEMS, INC.;COTE, ANDRE;DUSCHEK, DETLEF 发明人 COTE, ANDRE;DUSCHEK, DETLEF
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