发明名称 Dynamic fluid sprayjet delivery system
摘要 An adaptable semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. Within the enclosure is a sprayer delivery system with a height-controllable sprayer for spraying hot components. The sprayer delivery system has an actuator configured to move the sprayer among positions for spraying different components. The actuator can be of the types used for ink-jet printers or X-Y plotters. Alternatively, the actuator can be a continuous ribbon loop, or a series of radially extending rails. The actuator and sprayer are controlled by a controller, which also controls a configuration system that configures the sprayer delivery system for use with different boards. The controller uses sensors that sense the temperature of the hot components.
申请公布号 US7240500(B2) 申请公布日期 2007.07.10
申请号 US20030664256 申请日期 2003.09.17
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 BASH CULLEN E.;PATEL CHANDRAKANT D.;SHARMA RATNESH K.
分类号 F28C1/00;B05B15/08;G06F1/20;H01L23/473 主分类号 F28C1/00
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