PHOTOSENSITIVE RESIN COMPOSITION AND UTILIZATION THEREOF

摘要

A photosensitive resin composition which can be imidized at a lower temperature than conventional ones and which, when superposed as a photosensitive dry film resist on an FPC substrate or the like, causes little warpage and is excellent in flexibility, flexural properties, electrical reliability, and photosensitivity. It has flame retardancy. The photosensitive resin composition is characterized by comprising (A) a polyimide precursor comprising specific structural units, (B) a (meth)acrylate compound, (C) a photoreaction initiator, and (D) a phosphorus compound flame retardant.