COMPLIANT TERMINAL MOUNTINGS WITH VENTED SPACES AND METHODS

摘要

A compliant structure 36 is provided on a semiconductor wafer 22. The compliant structure 36 includes cavities 42. The compliant structure 36 and the wafer 22 seal the cavities 42 during process steps used to form conductive elements on the compliant structure. After processing, vents 58 are opened to connect the cavities 42 to the exterior of the assembly. The vents 58 may be formed by severing the wafer and compliant structure to form individual units 62 , so that the severance planes 34a intersect channels or other voids communicating with the cavities 42. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.