| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor testing substrate capable of detecting defective contact with a semiconductor device, without providing a circuit additionally to the semiconductor device of a testing object. SOLUTION: A burn-in device 1 sets an electric power source and a GND at 0 V, a control signal-1 (IN1 terminal) at 5 V, and a control signal-2 (IN2 terminal) at 0 V respectively, in a pretest before a burn-in test, to be output to a burn-in substrate 2, and monitors a monitor output (Monitor terminal). Protection diodes D11, D13, D15 within the semiconductor device are turned on when a PIN 1 terminal of the burn-in substrate 2 is connected normally to a control terminal of the the semiconductor device to make a current flow into an electric power source VCC side, a voltage of the PIN 1 terminal goes down thereby in the vicinity of 0 V, and a monitor output comes to zero therein. The PIN 1 terminal is brought into an open condition when the defective contact exists, diodes D1, D2, D3 are thereby turned on, and the monitor output is brought therein into a value provided by voltage-dividing 5 V with a resistance R0 and a resistance R1. COPYRIGHT: (C)2007,JPO&INPIT
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