HIGH PERFORMANCE REWORKABLE HEATSINK AND PACKAGING STRUCTURE WITH SOLDER RELEASE LAYER, AND METHOD OF MAKING

摘要

PROBLEM TO BE SOLVED: To provide a method of making and a high-performance reworkable heatsink and a packaging structure comprising the heatsink with solder release layer. SOLUTION: The heatsink includes a heatsink base frame. A heat pipe or one selected out from vapor chambers and a plurality of parallel fins are soldered to the heatsink base frame. The solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a melting temperature range lower than each solder used for fixing the heat pipe or one selected out from the vapor chambers and a plurality of the parallel fins to the heatsink base frame. After the solder release layer is applied, the heat pipe or the vapor chamber is filled with a selected heat transfer medium. COPYRIGHT: (C)2007,JPO&INPIT