| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a capacitor incorporated into a wiring board capable of forming a plated film on an external electrode layer efficiently by electrolytic plating, and to provide the capacitor incorporated into a wiring board suitable for incorporation into the wiring board. SOLUTION: When manufacturing the capacitor 1, a laminate 29 is formed first, and external electrode patterns 30, 31 are formed on the laminate 29 over a plurality of capacitor formation regions R, are electrically connected to internal electrode patterns 21, 23 in each capacitor formation region R, and are baked to external electrode layers 8, 9. Then, perforated break grooves 29c penetrating the external electrode patterns 30, 31 are formed for baking in the laminate 29 along at least one portion of the boundary of respective capacitor formation regions R. Then, current is supplied to the external electrode layers 8, 9, plated films 10, 11 are formed on the external electrode layers 8, 9 by electrolytic plating, and the laminate 29 is divided along the break groove 29c. COPYRIGHT: (C)2007,JPO&INPIT
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