摘要 |
Process control monitors 100, 102, and 104 are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device 108. Analysis of the process control monitors 100, 102, and 104 can provide information regarding properties of the MEMS device 108 and components or sub-components in the device. This information can be used to identify errors in processing or to optimize the MEMS device 108. In some embodiments, analysis of the process control monitors 100, 102, and 104 may utilize optical measurements. |