| 摘要 |
A method and an apparatus for bonding electronic components for manufacturing a flat panel display are provided to improve work efficiency to realize mass production by performing an unloading process on a substrate after bonding of the electronic components. A substrate mounting unit(10) is formed on transfer equipment(1). The transfer equipment is installed centering around a horizontal shaft(12) so as to be angle-rotatable. Loading equipment(2) is fixed on an opposite side of the substrate mounting unit formed on the transfer equipment. The loading equipment moves a substrate to the substrate mounting unit of the transfer equipment to mount it. Film bonding equipment(3) is used to attach an anisotropic conductive film to the substrate. Auxiliary bonding equipment(4) preliminarily bonds a chip or electronic components to be mounted on the substrate. Main bonding equipment(5) mainly bonds the chip or the electronic components to be mounted on the substrate. Unloading equipment separates the substrate from the substrate mounting unit and unloads it in a state that the electronic components are mainly bonded to the substrate.
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