发明名称 |
System for peeling semiconductor chips from tape |
摘要 |
A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided in the housing adjacent the nose. A vacuum source controllably connects to the apertures and the vacuum ports. The nose is positioned adjacent a tape attached on the opposite side thereof to the target chip. Vacuum is applied to attract the tape against the nose and the adjacent portions of the housing to peel the tape from the peripheral edges of the target chip while supporting the tape in the center of the target chip.
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申请公布号 |
US7238258(B2) |
申请公布日期 |
2007.07.03 |
申请号 |
US20050907991 |
申请日期 |
2005.04.22 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
PARK SOO-SAN;MIN GAB-YONG;JEONG JIN-WOOK;LEE HEE BONG;LEE JASON |
分类号 |
B32B38/10;H01L21/687 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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