| 摘要 |
An apparatus for preventing wafer dry when a wafer is stopped during wet processing is provided to prevent surface damage of the wafer by preventing the exposure of slurry component remaining on the wafer. An upper spray nozzle(200) is spaced apart from an upper arm, and has plural spray holes(202) arranged along a longitudinal direction thereof. A lower spray nozzle(210) is spaced apart from a lower arm(110), and has plural spray holes arranged along a longitudinal direction thereof. A supply pipe(300) is connected to the upper and lower spray nozzles to supply deionized water. A dispenser(500) is fixed to the upper spray nozzle by a fixing bracket(400), and a drain pipe(600) is connected to one end of the dispenser.
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