| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a chip type network electronic component which can reduce failure due to short circuit between terminals by preventing a conductive paste forming an upper surface electrode from unnecessarily oozing into a split groove, and can remarkably improve yield by reducing the proportion of determining of unaccepted product in visual appearance inspection of a width dimension of a side surface electrode. <P>SOLUTION: The method is provided with a process of forming a plurality of combinations of upper surface electrodes 14 over any of split grooves 11 in all directions of split grooves 11 on a portion one opposite portion of the upper surface of a sheet-like substrate 12 having the split grooves 11 in all the directions; and a process of forming an upper surface common electrode 14a on the other opposite portion on the upper surface of the sheet-like substrate 12 so that both the opposite portions can be electrically connected. In any one of the split grooves in all the directions of the sheet-like substrate, the depth of the split groove of a portion where the plurality of combinations of the upper surface electrodes are formed is made deeper than the depth of the split groove of a portion positioned between the plurality of combinations of upper surface electrodes 14. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
