METHOD FOR FORMING METAL FILM OR STACKED LAYER INCLUDING METAL FILM WITH REDUCED SURFACE ROUGHNESS

摘要

A method for forming a metal film with a reduced surface roughness is described. A sputtering process is conducted using a metal target to deposit a layer of metal on a substrate, wherein the DC power density over the sputtered surface of the metal target is set higher than 5 W/inch², and the layer of metal has a thickness of 4000Å or less.