| 摘要 |
A substrate cleaning method is provided to obtain particle control effect regardless of the kind of a substrate by preventing particles from being left on the surface of a substrate having a hydrophobic potion on its surface. While a substrate is rotated for at least a period of time, liquid is supplied to a substrate to clean the substrate. The substrate is dried by the following steps. The RPM(revolution per minute) of the substrate is reduced to a first RPM lower than that of a process for cleaning the substrate. When the RPM of the substrate is reduced to the first RPM, a transfer of a liquid supply position from almost the center of the substrate toward the peripheral part of the substrate is initiated. The liquid supply stops when the RPM of the substrate reaches a second RPM lower than first RPM. The second RPM is increased. A gas is supplied to the substrate while the substrate is rotated to an RPM higher than the second RPM. The process for cleaning the substrate includes the following steps. Chemicals are supplied to the surface of the substrate. While the substrate is rotated, a rinse solution is supplied to the surface of the substrate to rinse the substrate.
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