| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To effectively prevent interference among multiple circuits mounted on one module substrate and reduce a mount space required. <P>SOLUTION: A transmitter composed of wiring patterns 55a to 55d formed on a first principal surface and electronic patterns mounted on the wiring patterns is formed on the first principal surface of a module substrate 50. A receiver composed of wiring patterns 61a to 61d formed on a second principal surface and electronic components mounted on the wiring patterns is formed on the second principal surface of the module substrate 50. A second layer 52 to be connected to a ground pattern in the transmitter is formed in the inner layer of the module substrate 50, and a third layer 53 to be connected to a ground pattern in the receiver is formed in an inner layer nearer to the second principal surface in comparison with that for the second layer 52. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
