| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip mounter to stack and mount a plurality of chips so that entire thickness can be set in high accuracy. SOLUTION: The chip mounter is provided with a mounting tool 11 which stacks and mounts a plurality of chips T1-T3 to a substrate in sequence by means of paste; a laser displacement gauge 15 which has a detection surface 16 to detect a height between the substrate or a chip mounted to the substrate and the detection surface; and a controller which can control a pressing force to be given to the chip by lowering a mounting tool, so that a difference detected by the laser displacement gauge between a height from the substrate or the chip mounted to the substrate to the detection surface and that of a holding surface holding the chip of a mounting tool may be a specified value when the chip is mounted to the substrate. COPYRIGHT: (C)2007,JPO&INPIT
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