发明名称 |
METHOD FOR FORMING RESISTOR ON INSULATING SUBSTRATE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a production method of a printed circuit board having integrally plated resistors. <P>SOLUTION: This production method of a printed circuit board comprises: applying an etching resist to a part of a metal surface of a metal-coated laminated boards; forming a metal circuit by corroding and removing an exposed metal surface; peeling the resist; plating an exposed region of the core with a resister material having a volume resistivity of 500 to 1×10<SP>-4</SP>Ωcm; and trimming the resistable material so that the resistor has an insulating resistance equal to a predetermined ohm value. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
申请公布号 |
JP2007158362(A) |
申请公布日期 |
2007.06.21 |
申请号 |
JP20070001542 |
申请日期 |
2007.01.09 |
申请人 |
MACDERMID INC |
发明人 |
KUKANSKIS PETER;FRITZ DENNIS;DURSO FRANK;CASTALDI STEVEN;SAWOSKA DAVID |
分类号 |
H05K1/16;H01C7/00;H01C17/16;H01C17/24;H01C17/242;H01L23/12;H05K3/06;H05K3/18 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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