发明名称 |
Device and method for cutting an assembly |
摘要 |
A method is presented for cutting an assembly that includes two layers of material having a first surface and a second surface. The method includes providing a weakened interface between the two layers that defines an interface ring about the periphery of the assembly, providing a high-pressure zone at the interface ring, and providing at least one controllable low-pressure zone in the vicinity of at least one of the first surface and the second surface. The technique also includes supplying the high-pressure zone with a controllable high-pressure force, and attacking the interface ring with at least one mechanical force in combination with the high-pressure force to cut the assembly.
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申请公布号 |
US7232738(B2) |
申请公布日期 |
2007.06.19 |
申请号 |
US20040886436 |
申请日期 |
2004.07.06 |
申请人 |
S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES S.A. |
发明人 |
RAYSSAC OLIVIER;LETERTRE FABRICE |
分类号 |
B28D5/04;H01L21/46;B28D5/00;H01L21/20;H01L21/762 |
主分类号 |
B28D5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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