发明名称 LED chip capping construction
摘要 An LED chip capping construction to enhance luminance of the LED containing a condenser capping over a chip of the LED; a condensing part of the condenser protruding through a carrier and surrounded by multiple condensing aspects; the source light from the chip passing the condenser and consistently reflected to each condensing aspect due to the medium characteristics of the condenser.
申请公布号 US7233106(B2) 申请公布日期 2007.06.19
申请号 US20040890098 申请日期 2004.07.14
申请人 TAIWAN OASIS TECHNOLOGY CO., LTD. 发明人 LEE MING-SHUN;SUNG PING-RU
分类号 H05B33/00 主分类号 H05B33/00
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