| 摘要 |
<p>Disclosed is a photosensitive composition having excellent developability, soldering heat resistance, fracture resistance and pressure cooker resistance which is preferably used for manufacturing flexible printed circuit boards. The cured coating film of such a photosensitive composition is significantly improved in flexibility. Also disclosed are a method for forming a pattern and a permanent pattern. The photosensitive composition contains at least a polyurethane resin (A) having a carboxyl group, a polymerizable compound (B), a photopolymerization initiator (C) and a thermal crosslinking agent (D). The polyurethane resin (A) having a carboxyl group is preferably obtained by reacting a diisocyanate compound represented by the constitutional formula (I) below with a diol compound represented by the constitutional formula (II) or the constitutional formula (III) below.</p> |
