发明名称 |
Method of manufacturing semiconductor device, mask and semiconductor device |
摘要 |
A method of manufacturing a semiconductor device answerable to refinement of circuits by correctly connecting adjacent small patterns with each other with excellent reproducibility in connective exposure and a semiconductor device manufactured by this method are proposed. According to this method of manufacturing a semiconductor device, connective exposure is performed by dividing a pattern formed on a semiconductor substrate into a plurality of patterns and exposing the plurality of divided patterns in a connective manner, by forming marks for adjusting arrangement of the patterns to be connected with each other on the semiconductor substrate before exposing patterns of a semiconductor element and connectively exposing the patterns of the semiconductor element in coincidence with the marks for adjusting arrangement.
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申请公布号 |
US2007134564(A1) |
申请公布日期 |
2007.06.14 |
申请号 |
US20060602505 |
申请日期 |
2006.11.21 |
申请人 |
MAEJIMA SHINROKU;SHIRAI SEIICHIRO;MACHIDA TAKAHIRO |
发明人 |
MAEJIMA SHINROKU;SHIRAI SEIICHIRO;MACHIDA TAKAHIRO |
分类号 |
G03C5/00;G03F1/00;G03F1/68;G03F9/00;H01L21/027 |
主分类号 |
G03C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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