| 摘要 |
A die-attaching paste composition is provided to show reduced elastic modulus, and increased water resistance and oxidative stability, to improve a mechanical strength, to decrease a thermal deformation, and therefore to improve reliability of a semiconductor package product. The die-attaching paste composition comprises 50 to 70 % by weight of liquid or solid epoxy, 3 to 10 % by weight of acrylate and 25 to 40 % by weight of a flexing agent, wherein the die-attaching paste composition further comprises 1 to 7 % of a UV initiator, and 5 to 30 % of an organic filler which is any one mixture selected from a mixture of a hydrogenated nitrile rubber(HNBR) and a polybutadiene rubber, and a mixture a hydrogenated nitrile rubber(HNBR) and a silicone rubber on the basis of the total weight of the die-attaching paste composition. |
