| 摘要 |
A heat processing apparatus is provided to prevent a great impact on a substrate transferred along a transfer path in one direction such that the impact is caused by a transfer by performing a heat treatment on the substrate. A substrate is transferred in one direction by a transfer path. The substrate transferred in the transfer path is heated by a heating unit. A preliminary heating part(7a) and a main heating part(7b) are sequentially disposed along the transfer path from the upper part of the transfer direction wherein the main heating part is set at a first temperature and the preliminary heating part is set at a second temperature higher than the first temperature. After the substrate is heated to the neighborhood of the first temperature in the preliminary heating part, the substrate is heated to the first temperature in the main heating part. The preliminary heating part can be disposed in a manner that the substrate passes through the preliminary heating part when the substrate transferred in the transfer path reaches the neighborhood of the first temperature.
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