| 摘要 |
A substrate for manufacturing an FBGA(Fine-pitch Ball Grid Array) package is provided to improve the productivity by increasing the number of FBGA packages formed on one strip level substrate as well as one disc using an optimum and maximum sized strip level substrate. A packaging process is performed by using a strip level substrate(40) with a plurality of unit level substrates(42). The size of the strip level substrate is in a predetermined range of 240 mm x 74 mm. The size of the strip level substrate has a fluctuation width of ± 10 mm or less. The number of unit level substrates on the strip level substrate is 120.
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