发明名称 WIRING BOARD FOR MOUNTING COMPONENT ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To solve the problems that poor mounting of a metal member occurs since a sealing resin is apt to intrude into a clearance between a through-hole of a wiring board and the metal member to which a component element inserted into the through-hole is mounted, and also, deterioration in reflected-light flux is increased due to discoloration of silver plating or nickel plating caused by heat generation of the component element or ultraviolet rays regarding an LED device. <P>SOLUTION: The wiring board for mounting a component element is provided with the wiring board having the through-hole; a first metal member which has a protrusion on the upper face, a recess on the lower face, and the tip formed into a flat face by caulking its protruding part while fitting it into the through-hole; and a second metal member which has a protrusion fitted into the recess of the first metal member, so as to increase heat-dissipation capacity by fitting the protrusion of the second metal member into the recess of the first metal member. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007134494(A) 申请公布日期 2007.05.31
申请号 JP20050326027 申请日期 2005.11.10
申请人 HITACHI AIC INC 发明人 SUGIURA RYOJI
分类号 H01L33/64 主分类号 H01L33/64
代理机构 代理人
主权项
地址