| 摘要 |
PURPOSE: To provide a contact of high reliability by comprising an array of at least three parallel columns comprising at least one row of mutual connection structure with a substantially equal mutual distance, with the column array away from each other by an interval of a specified value or larger, so that there is almost even pressure in each contact area. CONSTITUTION: In a substrate 2 provided with plural rows of conductive mutual connection structures 3 which realize conductive contact, especially ones using pressure contact, the mutual connecting structure 3 is present at least one row with a substantially equal mutual distance d, and the substrate 2 comprises array of at least three parallel columns of comprising at least one row of the mutual connecting structure 3, with the column array away from each other by at least 5d. For example, the substrate 2 is of semiconductor material, and the mutual connecting structure (bump) 3 over it is jointed in electric conductive manner by pressure contact to the conductor pattern on a supporting substrate 4 of glass, quartz, ceramics material, synthetic resin, etc., so as to keep a pressure of the pressure contact with a connecting agent 5 or clamping structure. |
