Au-Sn ALLOY BUMP HAVING NO TRAPPED-IN LARGE VOID AND PROCESS FOR PRODUCING THE SAME

摘要

An Au-Sn alloy bump having no trapped-in large void; and a process for producing the same. There is provided an Au-Sn alloy bump having no trapped-in large void, which alloy bump has a composition comprising 20.5 to 23.5 mass% of Sn and the balance of Au and unavoidable impurities and has a structure wherein 0.5 to 30 area% of Sn-rich primary crystal phase is precipitated in the basis material.