| 摘要 |
One aspect of the invention relates to an interconnecting element between a semiconductor chip of a semiconductor wafer and a circuit support and to a method for producing and using the interconnecting element. Such interconnecting elements are arranged between contact areas of a semiconductor chip of a semiconductor wafer and contact terminal areas of a circuit support. The contact areas on the semiconductor chip or the semiconductor wafer, respectively, are arranged in depressions of a top of an insulating cover layer and are freely accessible. The interconnecting elements have a mushroom shape with a mushroom cap in a first metal area. On the mushroom cap of the first metal area, a second metal area is arranged which has high-melting intermetallic phases of metals of a solder material and the metal of the contact terminal areas of the circuit support. |
