METHODS AND SYSTEMS FOR MEASURING A CHARACTERISTIC OF A SUBSTRATE OR PREPARING A SUBSTRATE FOR ANALYSIS

摘要

Methods and systems for measuring a characteristic of a substrate (90) or preparing a substrate (90) for analysis are provided. One method for measuring a characteristic of a substrate (90) includes removing a portion of a feature on the substrate (90) using an electron beam (110) to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate (90) for analysis includes removing a portion of a material on the substrate (90) proximate to a defect using chemical etching (88) in combination with an electron beam (110). The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate (90) for analysis includes removing a portion of a material on a substrate (90) proximate to a defect using chemical etching (88) in combination with an electron beam (110) and a light beam.