| 摘要 |
A board to board interconnection is provided for interconnection of parallel stacked printed circuit boards, with a like array of plated through holes on each of the boards. One connector assembly is insertable from the outside of one of the stacked printed circuit boards, and another electrical connector assembly is insertable from the opposite side of the stacked parallel boards. One of the connector assemblies includes a compliant portion connectible with a plated through hole and including a socket contact. The other connector includes terminals with compliant portions for interconnection with the other board, and includes a pin terminal extending from the compliant portion which is insertable through the printed circuit boards and into interconnection with the socket of the other electrical connector assembly.
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