发明名称 Heat dissipation module and heat pipe thereof
摘要 A heat dissipation module includes a heat pipe and a plurality of fins disposed around the heat pipe. The heat pipe includes a main body, a base, a first wick, a second wick and a working fluid. The main body has a top portion and a sidewall portion disposed around the top portion. The base is combined with the main body to form a closed chamber. The base is disposed corresponding to the top portion and has an uneven surface facing the top portion. The first wick is disposed on the sidewall portion and the top portion of the main body, the second wick is disposed on the base, and the working fluid is filled within the closed chamber.
申请公布号 US2007102143(A1) 申请公布日期 2007.05.10
申请号 US20060493650 申请日期 2006.07.27
申请人 DELTA ELECTRONICS, INC. 发明人 YU MIN-HUI;CHENG CHIN-MING;LIN CHI-FENG;CHEN CHIN-MING
分类号 F28D15/00 主分类号 F28D15/00
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