发明名称 PARTING MATERIAL FOR FLOORING
摘要 PROBLEM TO BE SOLVED: To provide a method of laying out wiring such as cables on a flooring easily at low cost without deteriorating the aesthetic appearance. SOLUTION: This parting material for flooring is formed by fitting an upper parting material and a lower parting material to each other. The parting material comprises the recessed upper parting material and the projecting lower parting material. The end of the projecting part of the lower parting material comprises a recess in which wiring such as cables can be laid out. The parting materials are installed at necessary positions not only between the flooring and a wall surface but also between two adjacent floorings at the center of the flooring. Consequently, the wiring such as cables can be laid out easily at low cost without impairing the aesthetic appearance. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007107327(A) 申请公布日期 2007.04.26
申请号 JP20050301112 申请日期 2005.10.17
申请人 TOPPAN COSMO INC 发明人 HARIMA HAJIME
分类号 E04F19/02 主分类号 E04F19/02
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