IC COMPONENT COMPRISING A COOLING ARRANGEMENT

摘要

The invention relates to an IC component (2) comprising a cooling arrangement (1) which is embodied as an electronic housing provided with a cooling body (7). According to the invention, the IC component (2) is directly arranged on the cooling body (7) in the electronic housing. The invention advantageously provides a cooling arrangement (1) for IC components (2) that enables the IC component (2) to be efficiently and directly cooled and assembled in a simple manner, without requiring additional components. It is especially suitable for applications in electronic housings in the automobile industry.