| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed circuit board that reduces damage in the outer layer material removal process. SOLUTION: This multilayer printed circuit board manufacturing method contains a process for forming an inner layer pattern 20 in a core substrate 1 partitioned as corresponding to a bendable flexible portion 22 and a hardened portion 21, a process for forming an outer layer by adhering an outer layer material 50 covering the core substrate 1 to the hardened portion 21, a process for forming an outer layer pattern 54 on the surface of the outer layer material 50, a process for removing a coating 58 which forms the outer layer material 50 and covers the flexible portion 22, and a process for shaping the contour of a laminated substrate formed through the above coating removal process. This method creates an inner layer protection pattern 25 in the periphery of the flexible portion 22 prior to the above outer layer formation process, and then cuts the periphery of the coating 58 by irradiating laser beams LS to the external layer material 50 corresponding to the inner layer protection pattern 25 before the removal process. In this way, this method manufactures the multilayer printed circuit board by removing the coating 58 without damage to the flexible portion 22. COPYRIGHT: (C)2007,JPO&INPIT |
